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HMT氫微印技術 - 用于金屬和合金材料的氫脆研究
金屬試樣制備：對試樣進行拋光處理； 試樣充氫：充氫電流密度10mA/cm^2, 溶液采用0.2mol/L，H2SO4+2.5g/L CH4N2S，充氫時間48小時； 形核乳液制備：0.5g AgBr+40mL 5wt% NaNO2； 將已充氫試樣置于形核乳液中，使得擴散的氫原子與Ag離子反應在試樣表面形成Ag顆粒； 將試樣放置于固化溶液中保持3秒，固化溶液為40%volCH2O，使得已形成的Ag顆粒固定； 將試樣轉移放入清洗液中，保持5min，以移除試樣表面未反應殘留的AgBr顆粒（清洗液組成：15wt% Na2S2O3+10wt%NaNO2）； 將試樣用去離子水和酒精沖洗、干燥； 試樣放置于SEM中觀察。【Ag顆粒的分布位置與原始氫擴散區域相關，通過SEM觀察分析，HMT探索氫脆的一個有效技術。】 
（a）和（b）the principle of HMT involves a redox reaction between hydrogen atoms and Ag ions; HMT技術原理及氫原子和銀離子反應；Ag顆粒在H原子最初富集處形成； （c-c1) the distribution characteristics of Ag particles of the S1050 specimen show that hydrogen was mianly concentated at the austenite grain boundaries奧氏體晶界。 Regions marked as c1 and c2 in the region (c) are magnified, and the inset diagram illustrates the distribution of Ag elements銀顆粒的分布。 (d-d2) the distribution characteristics of Ag particles of S1200 specimen reveal that hydrogen was primarily concentrated at the interface between the ribbon-like δ-ferrite and austentite銀顆粒在鐵素體和奧氏體界面富集。 (d1) and (d2) are enlarged views of the marked areas in(d).